With the syringe pump out the size of a pea and it should cover the contact
faces , if it oozes out from the side clean it out with a Q-Tip.
The pressure of the spring and the thixotropic nature of the thermal
compound determines the thickness of the application.
Running the anti-virus and the anti-spyware constantly will rob you of
memory , speed of CPU , and resources , make the putter slow.
Vitally
-----Original Message-----
From: carolt62
Sent: Tuesday, June 14, 2011 11:20 AM
To: thecomputerhardwaretechnician@yahoogroups.com
Subject: [The Computer Hardware Technician] Application of thermal compound
for processor
I have disassembled (using Dell's online service manual) two Dell Inspiron
9300s and combined them into one. Because I had to separate the heat sink
from the processor (2.13 Intel Celeron), I had to reapply the thermal
compound to the processor before putting the heat sink back on. Everything
works great except that the computer now runs at 233 mhz instead of 2.13
ghz. From what I know about computers and the heat sink, I am pretty sure
the problem is my application of the thermal compound.
Before I spend big bucks to take my machine to a shop, I need advice about
how to apply the compound correctly. I've read and printed out several
online places where it tells how to do it.
I know the problem doesn't lie with my had drive, as I have a new hard drive
and I have a home network with an AT&T gateway and I have a computer
firewall and I have constantly running anti-virus software and anti-spyware.
Can you give me some advice? How thin does the application have to be?
Carol
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Vitally
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